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Understand and improve EMC of PCB!

The development IoE (internet of everything) the wearable device creates several problems related to the electromagnetic compatibility (EMC). The EMC characteristic has a significant effect on the operation of the devices. The producers need to pass the EMC standard test before releasing to market.

However, the EMC problem is still not correctly understood by the design engineer. Electromagnetic interference and susceptibility need to be understood clearly to successfully apply the solution to improve their PCB design. Carefully placing and routing the PCB can improve the EMC performance of the design.

However, a good understanding of the root of the EMC problem will help the engineer make a better design. EMC problem may be caused by internal and external components, thus solving the EMC problem require not only PCB design knowledge but also integrated circuit and system knowledge. Otherwise, the modifications/techniques applied to the PCB may be inefficient.

Who should attend this training course?

This training is dedicated to engineers involved in electronic design who are dealing with EMC issue in the PCB. No prerequisites in EMC are required. Knowledge of electronic, PCB design and manufacturing is necessary.

The Objectives of this training

* Clarify EMC issues at PCB level, discussing the effect of system level and on-chip level EMC to the PCB level EMC.

** Introduce the electromagnetic concepts related to PCB EMC issues, understand the effect of the electronic components and how to use them effectively.

*** Introduce the Signal Integrity, Power Integrity, RFI problem in PCB and method to solve these problems.

**** Present the main placement and routing techniques to improve EMC of PCB, learn how to analyze and manage EMC at PCB level, validate these techniques on real case studies.

Lecturer, who is he?

LECTURER

DR. HUYNH HAI AU (EMC/SI/PI for system and IC) 

Hai Au Huynh (S’13) received the B.S. degree in electronic engineering from the University of Science, Ho Chi Minh National University, Ho Chi Minh, Vietnam, in 2010, the M.S. and Ph.D. degree in engineering from Sungkyunkwan University, Suwon, South Korea, in 2013 and 2018, respectively. His current research interests include dc–dc converter design, parasitic modeling, and electromagnetic compatibility.


Achievement: Dr. Huynh Hai Au has several research article published in high impact journal and conference about EMC. He got two best paper award at IEEE EDAPS conference on 2015 and 2018. He has been awarded by the Institute of Electronics Engineers of Korea as the excellent researcher in 2018. 

  •   Postdoctoral Research 
  •   Sungkyungkwan University - South Korea
  •   Postdoctoral Research Fellowship
  •   Aarhus University - Denmark  
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EMI/EMC Program Training

Introduction to basic concepts for EMC at PCB level:

  • Introduction to EMC and EMC industrial standard

  • Spectral contents of signals

  • Impedance theory and impedance characteristic of components

  • Transmission line theory

  • Common-mode vs. differential-mode

  • Radiation

  • Ground and current return path

Tools to identify EMC issues at PCB level: 

  • Power spectrum analyzer

  • Vector network analyzer – Concept and guideline

  • Voltage probe and Current probe

  • Near-field probe

  • Estimation of PCB trace radiation from magnetic field measurement

  • Near-field EMI scanner

  • EMC qualification method (bulk current injection and direct power injection method)

EMC design rules for signal integrity (SI):

  • Frequency condition

  • Impedance control of PCB lines (single-ended and differential lines)

  • Routing of PCB traces, effect of via and stub

  • Control of reference plane

  • Effect of symmetry on differential lines

  • Crosstalk

  • Case study of SI

EMC design rules for power integrity :

  • Power distribution network of PCB

  • DC-DC converter, LDO application on PI

  • Decoupling capacitor on power integrity

  • Parasitic inductance effectiveness on PI

  • Simple model to analyze PI problem

  • Power-ground plane pairs

  • PCB base structure for improving PI

EMC design rules to reduce radiated emission:

  • Identification of parasitic antenna at PCB level

  • Reduce loop radiation

  • Shielding of sensitive traces

  • Board edge radiation

  • Effect of split planes

  • Radiation from cables

  • Placement of connectors

Case study 1: Improve EMC of a digital board

EMC design rules to reduce conducted emission:

  • Real performances of EMC filter

  • EMC filter placement

  • Transient suppressor placement

  • Case study: EMC filter

  • EMC design rules for DC-DC converter

Case study 2: Improve EMC of a DC-DC converter

  • Analyzing the EMC problem generated by DC-DC converter

  • Reference separation

  • Partitioning

  • Split planes

Case study 2: Improve EMC of a DC-DC converter (cont.)

  • Snubber technique

  • Active damping circuit solution

  • Switching node optimization for reducing EMI

  • Frequency Hopping techniques for DC-DC converter

Case study 3: Improving RFI for system in package

  • EMI improvement techniques for high speed devices (e.g. HBM, High Speed Camera, ..etc) Embedded shielding structure

  • Embedded shielding structure

  • Trombone line for FPCB

  • EBG shielding Structure for PC

Register link to join our EMI/EMC training course!

Please contact via hotline 028 6292 1170 or email info@pcb-graphtech.com.vn if you have any request.